JPH051976B2 - - Google Patents

Info

Publication number
JPH051976B2
JPH051976B2 JP60153159A JP15315985A JPH051976B2 JP H051976 B2 JPH051976 B2 JP H051976B2 JP 60153159 A JP60153159 A JP 60153159A JP 15315985 A JP15315985 A JP 15315985A JP H051976 B2 JPH051976 B2 JP H051976B2
Authority
JP
Japan
Prior art keywords
electrode
plate
magnetic field
processed
electrical resistance
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP60153159A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6214431A (ja
Inventor
Tetsuo Kurisaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shibaura Mechatronics Corp
Original Assignee
Shibaura Engineering Works Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shibaura Engineering Works Co Ltd filed Critical Shibaura Engineering Works Co Ltd
Priority to JP15315985A priority Critical patent/JPS6214431A/ja
Publication of JPS6214431A publication Critical patent/JPS6214431A/ja
Publication of JPH051976B2 publication Critical patent/JPH051976B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • ing And Chemical Polishing (AREA)
  • Drying Of Semiconductors (AREA)
JP15315985A 1985-07-11 1985-07-11 プラズマ処理装置 Granted JPS6214431A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15315985A JPS6214431A (ja) 1985-07-11 1985-07-11 プラズマ処理装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15315985A JPS6214431A (ja) 1985-07-11 1985-07-11 プラズマ処理装置

Publications (2)

Publication Number Publication Date
JPS6214431A JPS6214431A (ja) 1987-01-23
JPH051976B2 true JPH051976B2 (en]) 1993-01-11

Family

ID=15556323

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15315985A Granted JPS6214431A (ja) 1985-07-11 1985-07-11 プラズマ処理装置

Country Status (1)

Country Link
JP (1) JPS6214431A (en])

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2633870B2 (ja) * 1987-10-21 1997-07-23 株式会社日立製作所 ドライプロセス装置
JPH08319588A (ja) * 1996-06-17 1996-12-03 Hitachi Ltd プラズマエッチング装置

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5797616A (en) * 1980-12-10 1982-06-17 Anelva Corp Base plate for vacuum equipment
JPS58206125A (ja) * 1982-05-26 1983-12-01 Hitachi Ltd プラズマ処理装置

Also Published As

Publication number Publication date
JPS6214431A (ja) 1987-01-23

Similar Documents

Publication Publication Date Title
EP1166323B1 (en) Method and apparatus for compensating non-uniform wafer processing in plasma processing
KR890004172B1 (ko) 진공 스퍼터링장치
KR920004847B1 (ko) 스퍼터 장치
JP5702968B2 (ja) プラズマ処理装置及びプラズマ制御方法
JPH01312087A (ja) ドライエッチング装置
JPH0144791B2 (en])
US6167835B1 (en) Two chamber plasma processing apparatus
KR920007129A (ko) 마그네트론 플라즈마 처리장치 및 처리방법
SE521904C2 (sv) Anordning för hybridplasmabehandling
US5738751A (en) Substrate support having improved heat transfer
JP2004047730A (ja) プラズマ処理装置及びプラズマ処理装置用隔板
US8342121B2 (en) Plasma processing apparatus
JPH04279044A (ja) 試料保持装置
JP3173693B2 (ja) プラズマ処理装置及びその方法
JPH051976B2 (en])
TWI823457B (zh) 濺鍍裝置
JP2000156374A (ja) スパッタ処理応用のプラズマ処理装置
JPH02312231A (ja) ドライエッチング装置
JP4554117B2 (ja) 表面処理装置
JPH0770755A (ja) 基板を被覆あるいはエッチングする装置
JPH0476495B2 (en])
JPH0639693B2 (ja) 誘電体バイアススパツタリング装置
JPS5848421A (ja) ドライエツチング装置
JP3379506B2 (ja) プラズマ処理方法及び装置
JP2920852B2 (ja) マイクロ波プラズマ装置

Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees